A polymeric substrate for a moisture-sensitive electronic device includes a polymeric support having a top and bottom surface, and a desiccant layer disposed over at least a portion of the top or bottom surface of the polymeric support, or both.
申请公布号
US2006093795(A1)
申请公布日期
2006.05.04
申请号
US20040981167
申请日期
2004.11.04
申请人
EASTMAN KODAK COMPANY
发明人
WANG JIN-SHAN;VAETH KATHLEEN M.;O'TOOLE TERRENCE R.
