Semiconductor module, process for producing the same, and film interposer

摘要

A semiconductor module, comprising: a semiconductor element having a principal face on which an element electrode is formed; and a film member comprising an insulating resin layer having a front face and a rear face which is opposite to said front face, and a wiring pattern formed on the rear face of said layer, wherein said semiconductor element is superposed on said film member so that the principal face of said semiconductor element is in contact with the front face of the insulating resin layer of said film member; and a part of the wiring pattern of said film member extends through said insulating resin layer, so that said part is in contact with the element electrode of said semiconductor element.