| 摘要 |
An interconnect assembly is for use in connection a semiconductor device under test (DUT) having a plurality of leads to electronic test equipment. The interconnect assembly includes a cable including a plurality of wires with at lest one wire for sensing a signal from a DUT, at least one wire for a forcing signal to the DUT, and at least one wire for a guarding signal driven by the same electrical potential as the forcing signal. A male connector includes the plurality of wires, an outer metal coating surrounding the plurality of wires, and an insulating coating around the outer metal coating. A receptacle connector is for receiving the male connector and plurality of wires with corresponding contacts. |
