发明名称 PRINTED-WIRING BOARD AND METHOD OF PRODUCING THE SAME
摘要 <p>[Object] To provide a printed wiring board that can prevent occurrence of a short. [Constitution] A printed wiring board 100 has a via land 2A, a glass epoxy resin layer 3, a via conductor 6, and a block layer 4A. The via land 2A is formed on a core layer 1. The glass epoxy resin layer 3 is formed on the core layer 1 and the via land 2A. The via conductor 6 is formed on the via land 2A. The block layer 4A is formed on the via land 2A, between the via conductor 6 and the glass epoxy resin layer 3.</p>
申请公布号 EP1653789(A1) 申请公布日期 2006.05.03
申请号 EP20040746998 申请日期 2004.07.05
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 MORI, HIROYUKI;YAMANAKA, KIMIHIRO;KODAMA, YASUSHI
分类号 H05K1/03;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
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