发明名称 |
PRINTED-WIRING BOARD AND METHOD OF PRODUCING THE SAME |
摘要 |
<p>[Object] To provide a printed wiring board that can prevent occurrence of a short. [Constitution] A printed wiring board 100 has a via land 2A, a glass epoxy resin layer 3, a via conductor 6, and a block layer 4A. The via land 2A is formed on a core layer 1. The glass epoxy resin layer 3 is formed on the core layer 1 and the via land 2A. The via conductor 6 is formed on the via land 2A. The block layer 4A is formed on the via land 2A, between the via conductor 6 and the glass epoxy resin layer 3.</p> |
申请公布号 |
EP1653789(A1) |
申请公布日期 |
2006.05.03 |
申请号 |
EP20040746998 |
申请日期 |
2004.07.05 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MORI, HIROYUKI;YAMANAKA, KIMIHIRO;KODAMA, YASUSHI |
分类号 |
H05K1/03;H05K3/42;H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K1/03 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|