发明名称 Resistive memory device having array of probes and method of manufacturing the resistive memory device
摘要 Provided are a resistive memory device having a probe array and a method of manufacturing the resistive memory device. The resistive memory device includes a memory part (10) having a bottom electrode (100) and a ferroelectric layer (200) sequentially formed on a first substrate; a probe part (20) having an array of resistive probes (400) arranged on a second substrate (300), with the tips of the resistive probes facing the ferroelectric layer (200) such that they can write and read data on the ferroelectric layer; and a binding layer (500) which grabs and fixes the resistive probes on or above the ferroelectric layer. The method of manufacturing the resistive memory device includes forming a bottom electrode and a ferroelectric layer sequentially on a first substrate; forming an array of resistive probes for writing and reading data on a second substrate; and wafer level bonding the first substrate to the second substrate using a binding layer such that tips of the resistive probes face the surface of the ferroelectric layer.
申请公布号 EP1653473(A2) 申请公布日期 2006.05.03
申请号 EP20050255059 申请日期 2005.08.16
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HONG, SEUNG-BUM;KO, HYOUNG-SOO;JUNG, JU-HWAN;PARK, HONG-SIK
分类号 G11C11/22;G11B9/02;H01L21/8246 主分类号 G11C11/22
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