发明名称 |
Resistive memory device having array of probes and method of manufacturing the resistive memory device |
摘要 |
Provided are a resistive memory device having a probe array and a method of manufacturing the resistive memory device. The resistive memory device includes a memory part (10) having a bottom electrode (100) and a ferroelectric layer (200) sequentially formed on a first substrate; a probe part (20) having an array of resistive probes (400) arranged on a second substrate (300), with the tips of the resistive probes facing the ferroelectric layer (200) such that they can write and read data on the ferroelectric layer; and a binding layer (500) which grabs and fixes the resistive probes on or above the ferroelectric layer. The method of manufacturing the resistive memory device includes forming a bottom electrode and a ferroelectric layer sequentially on a first substrate; forming an array of resistive probes for writing and reading data on a second substrate; and wafer level bonding the first substrate to the second substrate using a binding layer such that tips of the resistive probes face the surface of the ferroelectric layer.
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申请公布号 |
EP1653473(A2) |
申请公布日期 |
2006.05.03 |
申请号 |
EP20050255059 |
申请日期 |
2005.08.16 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
HONG, SEUNG-BUM;KO, HYOUNG-SOO;JUNG, JU-HWAN;PARK, HONG-SIK |
分类号 |
G11C11/22;G11B9/02;H01L21/8246 |
主分类号 |
G11C11/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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