发明名称 |
Semiconductor device formed dam and mounting structure of the semiconductor device |
摘要 |
<p>A flip chip device may have a semiconductor chip with an active surface on which chip pads and a protective layer may be provided. Solder bumps may be provided on the active surface and electrically connected to the chip pads. And a solder bar may be provided on a portion of the protective layer. The solder bar may disperse thermal stress produced in the solder bumps. A metal core may be embedded within the solder bar. The flip chip device may be mounted on and flip-chip bonded to a substrate. The substrate may have land pads to which the solder bumps and the solder bar may be mechanically joined. The solder bar increases a joint area between the flip chip device and the substrate and reinforces solder connections therebetween.</p> |
申请公布号 |
KR100576156(B1) |
申请公布日期 |
2006.05.03 |
申请号 |
KR20030073862 |
申请日期 |
2003.10.22 |
申请人 |
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发明人 |
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分类号 |
H01L23/28;H01L21/60;H01L23/16;H01L23/31;H01L23/485;H01L23/498;H05K3/34 |
主分类号 |
H01L23/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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