发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, AND SUBSTRATE HOLDING APPARATUS
摘要 A substrate processing apparatus and a substrate processing method is provided for performing a chemical liquid process, a cleaning process, a drying process, or the like while rotating a substrate such as a semiconductor wafer or a liquid crystal substrate. A substrate holding apparatus is provided for holding and rotating a substrate. The substrate processing apparatus for processing a substrate while supplying a fluid to the substrate includes a substrate holder for holding and rotating the substrate, and a holder suction unit for sucking the fluid from the substrate holder. The substrate holding apparatus includes a plurality of rollers which are brought into contact with an edge portion of a substrate so as to hold and rotate the substrate, and at least one moving mechanism for moving the rollers.
申请公布号 EP1652222(A1) 申请公布日期 2006.05.03
申请号 EP20040771154 申请日期 2004.07.28
申请人 EBARA CORPORATION 发明人 YAMADA, KAORU;SAITO, TAKAYUKI;YABE, SUMIO;ITO, KENYA;KAMEZAWA, MASAYUKI;SEKI, MASAYA;KATAKABE, ICHIRO;INOUE, YUKI
分类号 B08B1/04;B08B3/02;C23C18/16;C25D7/12;H01L21/00;H01L21/304;H01L21/306;(IPC1-7):H01L21/304 主分类号 B08B1/04
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