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发明名称
THE FABRICATING METHOD OF INTERCONNECTION OF SEMICONDUCTOR DEVICE HAVING IMPROVED ADHESIVENESS
摘要
申请公布号
KR20060038154(A)
申请公布日期
2006.05.03
申请号
KR20040087339
申请日期
2004.10.29
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
SHIN, CHUNG HWAN
分类号
H01L21/3205
主分类号
H01L21/3205
代理机构
代理人
主权项
地址
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