发明名称 |
MULTI-LAYER POLISHING PAD MATERIAL FOR CMP |
摘要 |
The invention is directed to a polishing pad for chemical-mechanical polishing comprising an optically transmissive multi-layer polishing pad material, wherein the optically transmissive polishing pad material comprises two or more layers that are joined together without the use of an adhesive. |
申请公布号 |
EP1651388(A2) |
申请公布日期 |
2006.05.03 |
申请号 |
EP20040776265 |
申请日期 |
2004.06.03 |
申请人 |
CABOT MICROELECTRONICS CORPORATION |
发明人 |
PRASAD, ABANESHWAR;SEVILLA, ROLAND, K.;LACY, MICHAEL, S. |
分类号 |
B24B7/30;B24B37/20;B24D3/32;B24D13/14 |
主分类号 |
B24B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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