| 摘要 |
An insulating arrangement is described which provides supplementary insulation to electrical components (C) including a set of contact pins (12) for mounting the component (C) on a support substrate (PCB). The arrangement includes a casing (10) of an electrical insulating material, the casing (10) having a peripheral wall surrounding the component (C) and having a lower peripheral rim. The peripheral wall, and possibly also the top and/or bottom walls of the casing, has a wall thickness at least equal to a given thickness (S). The distance of any said contact pins (12) to the lower peripheral rim of the casing is at least equal to a given a distance (x). The given thickness (S) and the given distance (x) jointly provide an electrical insulation barrier around said component (C). |
