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发明名称
METHOD OF PACKAGING OF MEMS DEVICE AT THE VACUUM STATE AND VACUUM PACKAGED MEMS DEVICE USING THE SAME
摘要
申请公布号
KR100575363(B1)
申请公布日期
2006.05.03
申请号
KR20040025198
申请日期
2004.04.13
申请人
发明人
分类号
B81C1/00;G01P9/04;B81B3/00;B81C3/00;B81C99/00;G01C19/00;G01C19/56;H01L21/00;H01L29/84
主分类号
B81C1/00
代理机构
代理人
主权项
地址
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