METHOD OF MANUFACTURING CIRCUIT BOARD

摘要

A prepreg sheet having a base material and a resin with which the base material is impregnated is prepared. A laminated sheet is obtained by laminating a metal foil on the prepreg sheet. The laminated sheet is placed on a heater the temperature of which is kept at a temperature in proximity to the softening point of the resin and compressed at a predetermined pressure and at the temperature. The metal foil on the laminated sheet and the prepreg sheet are bonded together and the resin is cured. In this way a circuit board is obtained. This method stabilizes the resistivity value of a conductive paste placed in a through hole even when a prepreg sheet has a low compression ratio.