发明名称 |
Methods and apparatus for attaching a die to a substrate |
摘要 |
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes depositing a plurality of contacts of bonding material between the substrate and die, and forming a bond between the die and the housing by applying at least 25,000 kilograms of force per gram of bonding material to the housing, the contacts, and the die.
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申请公布号 |
US7037805(B2) |
申请公布日期 |
2006.05.02 |
申请号 |
US20040878845 |
申请日期 |
2004.06.28 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
DCAMP JON B.;CURTIS HARLAN L.;DUNAWAY LORI A.;GLENN MAX C. |
分类号 |
H01L21/30;B81B7/00;G01C19/5719;H01L21/46;H01L21/60;H01L21/603 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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