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发明名称
Verfahren zum Abscheiden von Halbleiterschichten bzw. von isolierenden Schutzschichten aus anorganischem Material auf der Oberfläche von erhitzten Halbleiterscheiben
摘要
申请公布号
AT290624(B)
申请公布日期
1971.06.11
申请号
AT19690000298
申请日期
1969.01.13
申请人
SIEMENS AKTIENGESELLSCHAFT
发明人
分类号
(IPC1-7):H01L7/36
主分类号
(IPC1-7):H01L7/36
代理机构
代理人
主权项
地址
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