| 发明名称 |
Pin-deposition of conductive inks for microelectrodes and contact via filling |
| 摘要 |
A method of metalization of an integrated microsystem. The method comprises providing a substrate and applying a conductive material to the substrate by taking up small aliquots of conductive material and releasing the conductive material onto the substrate to produce a circuit component.
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| 申请公布号 |
US7036220(B2) |
申请公布日期 |
2006.05.02 |
| 申请号 |
US20030742112 |
申请日期 |
2003.12.18 |
| 申请人 |
THE REGENTS OF THE UNIVERSITY OF CALIFORNIA |
发明人 |
DAVIDSON J. COURTNEY;KRULEVITCH PETER A.;MAGHRIBI MARIAM N.;HAMILTON JULIE K.;BENETT WILLIAM J.;TOVAR ARMANDO R. |
| 分类号 |
H05K3/10;H01L21/44;H01L21/768;H05K3/40 |
主分类号 |
H05K3/10 |
| 代理机构 |
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