发明名称 |
Package for integrated circuit die |
摘要 |
An integrated circuit device package and method of assembling same is disclosed. The device package includes an interposer ring substrate having a hollowed out center mounted on a die attach pad, a die mounted substantially in the center of the die attach pad such that the die is encompassed by the hollowed out center. The package further includes a single-piece drop-in heat sink having a first and second disk shaped portions where the first disk shaped portion has a diameter that is different than the second disk shaped portion.
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申请公布号 |
US7038305(B1) |
申请公布日期 |
2006.05.02 |
申请号 |
US20030621255 |
申请日期 |
2003.07.15 |
申请人 |
ALTERA CORP. |
发明人 |
CHET TAN PING;LENG ALLEN CHEAH CHONG |
分类号 |
H01L23/495;H01L21/44;H01L23/34;H01L23/48;H01L23/52 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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