发明名称 Selective etch process for making a semiconductor device having a high-k gate dielectric
摘要 A method for making a semiconductor device is described. That method comprises forming a high-k gate dielectric layer on a substrate, and modifying a first portion of the high-k gate dielectric layer to ensure that it may be removed selectively to a second portion of the high-k gate dielectric layer.
申请公布号 US7037845(B2) 申请公布日期 2006.05.02
申请号 US20030652546 申请日期 2003.08.28
申请人 INTEL CORPORATION 发明人 BRASK JUSTIN K.;SHAH UDAY;DOCZY MARK L.;KAVALIEROS JACK;CHAU ROBERT S.;TURKOT, JR. ROBERT B.;METZ MATTHEW V.
分类号 H01L21/302;H01L21/311 主分类号 H01L21/302
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