发明名称 |
Power chip resistor |
摘要 |
A method and apparatus for a stacked power chip resistor is disclosed. The invention provides for multiple power chip resistors to be stacked, providing for encapsulant such as glass to separate each power chip resistor and a metal barrier such as nickel plating on each end of the stacked power chip resistor to provide for electrical and mechanical connection of each power chip resistor in the stack.
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申请公布号 |
US7038572(B2) |
申请公布日期 |
2006.05.02 |
申请号 |
US20010811844 |
申请日期 |
2001.03.19 |
申请人 |
VISHAY DALE ELECTRONICS, INC. |
发明人 |
HUBER LOUIS PETER;SHOSHANI ZIV |
分类号 |
H01C1/012;H01C1/01;H01C3/12;H01C7/00;H01C7/18 |
主分类号 |
H01C1/012 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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