| 发明名称 |
SOLDER PASTE |
| 摘要 |
IN ORDER TO PREVENT AGING OF AN SN -- ZN SYSTEM ALLOY SOLDER PASTE, 0.5 - 5% BY WEIGHT OF A COMPOUND OBTAINED BY ADDING AN ETHYLENE OXIDE TO CYCLOHEXYLAMINE, PREFERABLY TOGETHER WITH 0.5 - 5% BY WEIGHT OF A POLYOXYETHYLENE ALKYLAMINE IS ADDED TO A FLUX OF SAID SOLDER PASTE. (FIG.1)
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| 申请公布号 |
MY122502(A) |
申请公布日期 |
2006.04.29 |
| 申请号 |
MYPI9803058 |
申请日期 |
1998.07.03 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;SENJU METAL INDUSTRY CO., LTD. |
发明人 |
HIROJI NOGUCHI;MASAHIKO HIRATA;TOSHIHIKO TAGUCHI;KUNIHITO TAKAURA |
| 分类号 |
B23K35/34;B23K35/02;B23K35/26;B23K35/36 |
主分类号 |
B23K35/34 |
| 代理机构 |
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