ELECTRODEPOSITED COPPER FOIL WITH CARRIER, METHOD FOR PRODUCING THE ELECTRODEPOSITED COPPER FOIL, AND COPPER-CLAD LAMINATE FORMED BY USE OF THE ELECTRODEPOSITED COPPER FOIL

摘要

TO CONTROL PEEL STRENGTH AT AN ORGANIC RELEASE INTERFACE BETWEEN A CARRIER FOIL AND A COPPER- MICROPARTICLE LAYER WHICH CONSTITUTE AN ELECTRODEPOSITED COPPER FOIL WITH CARRIER. IN THE PRESENT INVENTION, (1) A BARRIER COPPER LAYER IS FORMED ON THE RELEASE INTERFACE LAYER AND COPPER MICROPARTICLES ARE FORMED ON THE BARRIER LAYER; (2) THE ANTI-CORROSION TREATMENT IS CARRIED OUT BY USE OF A PLATING BATH CONTAINING A SINGLE METALLIC COMPONENT OR A PLURALITY OF METALLIC COMPONENTS FOR FORMING AN ALLOY, THE PLATING BATH(S) HAVING A DEPOSITION POTENTIAL LESS NEGATIVE THAN -900 MV (VS. AGCL/AG REFERENCE ELECTRODE); AND (3) METHODS (1) AND (2) ARE COMBINED. (FIG. 1)