| 摘要 |
THE PRESENT INVENTION PROVIDES A THIN, INEXPENSIVE, HIGH-PERFORMANCE SEMICONDUCTOR DEVICE PROVIDED WITH BUS BAR LEADS (3C), POWER LEADS (C) AND SIGNAL LEADS (3S). A PORTION OF THE POWER LEAD CONNECTED TO THE BUSBAR LEAD IS DEPRESSED TOWARD A MAJOR SURFACE OF A SEMICONDUCTOR CHIP (2) TO FORM DEPRESSED PORTION, AND THE DEPRESSED PORTION IS BONDED TO THE MAJOR SURFACE OF THE SEMICONDUCTOR CHIP (2) BY AN ADHESIVE LAYER (5). THE SIGNAL LEAD (3S) AND THE BUSBAR LEAD (3C) ARE SPACED APART FROM THE MAJOR SURFACE OF THE SEMICONDUCTOR CHIP (2).FIGURE 3 |
