VISCOSITY MODIFIER FOR THERMOSETTING RESIN COMPOSITION

摘要

A HEAT CURABLE THERMOSETTING EPOXY RESIN FORMULATION USEFUL FOR MAKING PREPREGS AND ELECTRICAL LAMINATES CONTAINING A VISCOSITY MODIFIER, WHEREIN THE VISCOSITY MODIFIER IS; @(a) AN OPTIONALLY SUBSTITUTED POLYMER OF A MONOVINYLIDENE AROMATIC MONOMER, OPTIONALLY HAVING ONE OR MORE FURTHER UNSATURATED MONOMERS COPOLYMERIZED THEREWITH;@(b) AN OPTIONALLY SUBSTITUTED POLYPHENYLENE OXIDE; OR@(c) AN OXAZOLIDONE RING-CONTAINING COMPOUND.