摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element excellent in light transmission rate, low stress property and further high strength. <P>SOLUTION: This epoxy resin composition for sealing the optical semiconductor element contains the following (A) to (C) components and the relationship of refractive index (n1) of a cured material obtained by curing a component other than the (C) component in the epoxy resin for sealing the optical semiconductor element and the refractive index (n2) of the (C) component satisfies formula (1): (-)0.01≤(n2-n1)≤0.01. Provided that the (A) to (C) components are; (A) an epoxy resin, (B) a curing agent and (C) spherical inorganic oxide composite particles equipped with the following characteristic (c), wherein the (c) is that the content of boron ion extracted under hot water extraction of the (C) at 120°C for 24 hr is ≤60 ppm. Also, provided that in the formula (1), n1: the refractive index of the cured material obtained by curing the components other than the (C) component, measured at 589.3 nm wavelength, and n2: the refractive index of the (C) component measured at 589.3 nm wavelength. <P>COPYRIGHT: (C)2006,JPO&NCIPI |