发明名称 EPOXY RESIN COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR ELEMENT AND OPTICAL SEMICONDUCTOR BY USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor element excellent in light transmission rate, low stress property and further high strength. <P>SOLUTION: This epoxy resin composition for sealing the optical semiconductor element contains the following (A) to (C) components and the relationship of refractive index (n1) of a cured material obtained by curing a component other than the (C) component in the epoxy resin for sealing the optical semiconductor element and the refractive index (n2) of the (C) component satisfies formula (1): (-)0.01&le;(n2-n1)&le;0.01. Provided that the (A) to (C) components are; (A) an epoxy resin, (B) a curing agent and (C) spherical inorganic oxide composite particles equipped with the following characteristic (c), wherein the (c) is that the content of boron ion extracted under hot water extraction of the (C) at 120&deg;C for 24 hr is &le;60 ppm. Also, provided that in the formula (1), n1: the refractive index of the cured material obtained by curing the components other than the (C) component, measured at 589.3 nm wavelength, and n2: the refractive index of the (C) component measured at 589.3 nm wavelength. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111823(A) 申请公布日期 2006.04.27
申请号 JP20040303290 申请日期 2004.10.18
申请人 NITTO DENKO CORP 发明人 OTA SHINYA;ITO HISATAKA
分类号 C08L63/00;C08K7/18;H01L23/29;H01L23/31;H01L33/48 主分类号 C08L63/00
代理机构 代理人
主权项
地址