| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device, having various types of reliabilities on which a semiconductor chip can be laminated, without using an adhesive by improving steps that include an adhesive application step having a defective workability in manufacturing an MCP (multi chip package) of a stacked structure. <P>SOLUTION: In a resin-sealed semiconductor device of a stacked structure as an MCP, a resin layer 3 as a set material of a photosensitive resin composition contains a cyclic olefin-based resin (A) having an acid group, a photo-oxidation agent (B), and a compound (C) having a reaction group combinable with the acid group of the olefin-based resin (A) at a temperature of 130°C or higher. The layer 3 is provided as a semiconductor element surface protecting film on the circuit component formation surface of a semiconductor chip 2, and the rear surface of another semiconductor chip 7 to be laminated on the chip 2 is in direct contact with the resin layer 3. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
