| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit connection material, which enhances adhesive power between a circuit and a substrate with a circuit electrode and a connection material electrically connecting a circuit and hardly generates migration, and also a circuit connection structure using the same. SOLUTION: The circuit connecting material contains (a) a polymer, (b) a radically polymerizable compound, (c) a radical generator and (d) a resin containing at least one epoxy group in a molecule. The circuit connecting material preferably contains no epoxy curing material and contains 1-20 pts.wt. of the component (d) for every 100 pts.wt. of the circuit connecting material. COPYRIGHT: (C)2006,JPO&NCIPI
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