| 摘要 |
PROBLEM TO BE SOLVED: To provide a one-package heat-curable epoxy resin composition, which is excellent in storage stability, gasohol resistance, heat curability within a range between low to moderate temperatures, the physical properties of the resulting cured products, and adhesive property. SOLUTION: The epoxy resin composition contains (A) an epoxy compound, (B) a curing agent composition obtained by causing (i) an amine compound to react with (ii) the epoxy compound, and (C) a filler. To 100 parts by weight of (A), 0.1 to 200 parts by weight of the curing agent composition (B) and 5 to 400 parts by weight of the filler (C) are compounded. The component (ii) in an amount of 0.01 to 5 mol is caused to react with 1 mol of the component (i). COPYRIGHT: (C)2006,JPO&NCIPI
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