发明名称 REMOVING LIQUID AND REMOVING METHOD OF COPPER DETERIORATED LAYER CONTAINING COPPER OXIDE
摘要 PROBLEM TO BE SOLVED: To provide a removing liquid which selectively removes a copper deteriorated layer containing copper oxide and/or copper oxide damaged by dry etching and/or ashing while suppressing the corrosion of copper. SOLUTION: The residue removing liquid of the copper deteriorated layer contains copper oxide damaged by dry etching and/or ashing consisting of monocarboxylic acid and water. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006114872(A) 申请公布日期 2006.04.27
申请号 JP20050160442 申请日期 2005.05.31
申请人 DAIKIN IND LTD 发明人 NAKAMURA SHINGO;KAMIYA FUMIHIRO;KEZUKA TAKEHIKO;KANEMURA TAKASHI;ITANO MITSUSHI
分类号 H01L21/304 主分类号 H01L21/304
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