发明名称 METHOD FOR MANUFACTURING MOUNTED SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To prevent the occurrence of contaminants, after a mounted substrate has been fitted to a product in the manufacturing method of the mounted substrate comprising a process for cutting a glass epoxy substrate, after a component has been mounted. SOLUTION: The glass epoxy substrate is cut, after the component has been mounted, the mounted substrate 4 is obtained. Liquid resin 2 is applied to the end face (cutting face) 41 of the mounted substrate 4 obtained and applied liquid resin 2 is cured. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006114528(A) 申请公布日期 2006.04.27
申请号 JP20040297209 申请日期 2004.10.12
申请人 SEIKO EPSON CORP 发明人 UEMATSU HIDEKAZU
分类号 H05K3/00;H05K3/28 主分类号 H05K3/00
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