发明名称 COMBINED TYPE RELAY DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a combined type relay device which secures an advantage of compaction, suppresses an increase in power consumption and secures operation reliability in a high temperature environment. SOLUTION: A pair of relay units 2, 3 are adjacently mounted on the same main surface of a bus bar substrate 1, and housed in a relay case 4. This double relay device can secures a larger coil current than a triplicate relay device. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006114409(A) 申请公布日期 2006.04.27
申请号 JP20040302189 申请日期 2004.10.15
申请人 ANDEN 发明人 SUZUKI HIROHISA;SATO KOICHI
分类号 H01H51/20;H01H45/00;H01H45/04;H01H50/04;H01H50/16;H01H85/02;H01H85/50 主分类号 H01H51/20
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