| 摘要 |
PROBLEM TO BE SOLVED: To provide a convenient soldering device meeting the demand that plural plating films are continuously formed in various with one conveyor rail. SOLUTION: This plating apparatus has at least two lines of plating bath moving means and plural plating baths contain a plating solution different in composition, respectively. The moving line each has empty bath and a washing bath. The plating baths on the lines are selected in accordance with the plating film to be formed on an electro conductive part 21. As a result, a combination of plural plating films are continuously formed on the part 21 with one conveyor rail. |
