| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To suppress a decline in tightening force of a screw mounted in a base plate in a semiconductor device having the base plate which is mainly formed of aluminum. <P>SOLUTION: The semiconductor device includes the base plate 1 mainly formed of aluminum and an insulation substrate formed on top of the base plate 1. The base plate 1 has a through-hole 20 to insert a fixing screw 14 for fixing the base plate 1 to a heat radiation fin 13, and a flat bush 2 which is installed in correspondence with the through-hole 20 and is mainly formed of copper or iron. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
