| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a compact acceleration sensor chip package and its manufacturing method. <P>SOLUTION: An acceleration sensor chip 11 comprises a frame part 13 for partitioning an opening 16 from an upper surface to a lower surface; a movable structure 15 including both a beam part 14a extended from the frame part into the opening and a movable part 14b movably supported by the beam part; a detection element 19 for detecting displacements of the movable structure; and a plurality of electrode pads 18 provided in such a way as to be exposed from the upper surface of the frame part. The acceleration sensor chip package 10 is provided with the acceleration sensor chip 11; a rewiring layer 17 having a plurality of wiring parts 17b having one-end sides electrically connected to the electrode pads; a plurality of external terminals 70 connected to the other-end sides of the wiring parts; a first closed-loop-like sealing part 20 provided for the acceleration sensor chip in such a way as to expose parts of the plurality of external terminals for sealing the electrode pads and the rewiring layer; and a substrate 12 in contact with the lower surface of the acceleration sensor chip for sealing the opening from the side of the lower surface. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
