| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide the cutting method of a semiconductor substrate, with which the semiconductor substrate can precisely be cut into semiconductor chips, with markedly improved cutting precision to the surface of the semiconductor substrate with a functional element mounted thereon. <P>SOLUTION: The method has a process of forming a melting processing region 13 inside the semiconductor substrate 11 by irradiating the inner part of the semiconductor substrate 11 with a laser beam along a cutting scheduled line, for forming a cutting scheduled part in the melting processing region, and for making a crack 15 reach the surface 3 of the semiconductor substrate from the melting processing region; and a process of cutting the semiconductor substrate 11 into the semiconductor chips along the cutting scheduled part. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
