发明名称 EPOXY RESIN COMPOSITION AND ITS CURED PRODUCT
摘要 PROBLEM TO BE SOLVED: To provide an eco-friendly epoxy resin composition giving a cured material having excellent heat-resistance and moisture-resistance and exhibiting excellent flame-retardancy without using a halogen-based flame-retardant and suitable for a printed circuit board, an interlayer insulation material for a printed circuit board and a resin-coated copper foil, a sealing material for electronic parts, a resist ink, a conductive paste, a coating material, an adhesive material, a composite material, etc., and provide a cured material of the resin composition. SOLUTION: The epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin having triazine ring and (C) a phosphorus compound having triazine ring, and the cured material is produced by curing the epoxy resin composition. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006111808(A) 申请公布日期 2006.04.27
申请号 JP20040302770 申请日期 2004.10.18
申请人 DAINIPPON INK & CHEM INC 发明人 MORIYAMA HIROSHI
分类号 C08G59/62;C08G59/50 主分类号 C08G59/62
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