发明名称 Soldering method and device
摘要 A soldering method in which, out of soldering steps of (a) during soldering, (b) before soldering, and (c) after soldering, in at least the steps of (a) during soldering and (b) before soldering, an alternating current whose frequency temporally changes in a band of 20 Hz-1 MHz is applied to at least any of (d) a solder material, (e) a soldering object, and (f) a peripheral portion thereof, and a modulated electromagnetic wave treatment is carried out by use of an electromagnetic field induced by the alternating current. Thereby, when not only a lead-containing solder material but also a lead-free solder material are used, wettability in soldering to a soldering object is made better, and an obtained soldered article is improved in strength, etc., compared to the conventional solder material.
申请公布号 US2006086718(A1) 申请公布日期 2006.04.27
申请号 US20050532981 申请日期 2005.04.28
申请人 TECHNO LAB COMPANY 发明人 FUKAMACHI SHIMPEI;OTANI HIROKAZU;FUJINO TAKASHI;FUKAMACHI ATSUSHI
分类号 B23K1/002;B23K1/08;B23K1/20;B23K3/06;B23K3/08;B23K35/14;B23K35/26;H05K3/34 主分类号 B23K1/002
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