发明名称 Method for forming silicon-germanium in the upper portion of a silicon substrate
摘要 A method for forming silicon-germanium in the upper portion of a silicon substrate, including the steps of: depositing a germanium layer doped at a concentration in dopant elements greater than 10<SUP>19 </SUP>atoms per cm<SUP>3 </SUP>on a silicon substrate; heating to have the germanium diffuse into the silicon substrate to form a doped silicon-germanium layer in the upper portion of the silicon substrate; and eliminating the germanium layer.
申请公布号 US2006088988(A1) 申请公布日期 2006.04.27
申请号 US20050258402 申请日期 2005.10.25
申请人 STMICROELECTRONICS CROLLES 2 SAS 发明人 HALIMAOUI AOMAR;BOEUF FREDERIC
分类号 H01L21/04 主分类号 H01L21/04
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