发明名称 |
Method for forming silicon-germanium in the upper portion of a silicon substrate |
摘要 |
A method for forming silicon-germanium in the upper portion of a silicon substrate, including the steps of: depositing a germanium layer doped at a concentration in dopant elements greater than 10<SUP>19 </SUP>atoms per cm<SUP>3 </SUP>on a silicon substrate; heating to have the germanium diffuse into the silicon substrate to form a doped silicon-germanium layer in the upper portion of the silicon substrate; and eliminating the germanium layer.
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申请公布号 |
US2006088988(A1) |
申请公布日期 |
2006.04.27 |
申请号 |
US20050258402 |
申请日期 |
2005.10.25 |
申请人 |
STMICROELECTRONICS CROLLES 2 SAS |
发明人 |
HALIMAOUI AOMAR;BOEUF FREDERIC |
分类号 |
H01L21/04 |
主分类号 |
H01L21/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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