| 摘要 |
<p>An electrical package for an integrated circuit die (101) which comprises a die-attach paddle (201) for mounting the integrated circuit die (101). The die-attach paddle (201) has at least one down-set area located on a periphery of the die-attach paddle (201). The down-set area has an upper surface and a lower surface, with the upper surface configured to electrically couple a first end of a first electrically conductive lead wire (301). A second end of the first electrically conductive lead wire (301) is bonded to the integrated circuit die (101). The upper surface is further configured to electrically couple a first end of a second electrically conductive lead wire (303) and a second end of the second electrically conductive lead wire (303) is bonded to a lead finger (203) of the electrical package.</p> |
