Chip-size package manufacture involves patterning dielectric layer to form openings exposing conductive lines

摘要

Dielectric layer (104) is patterned on a contact conductive layer, to form openings exposing a portion of a conductive line (103) of a dice (101). The conductive material of thickness 12-18 mu m is filled into the openings and is patterned. A UV curing type material layer is patterned to form openings exposing the conductive material, and solder balls are welded to the openings. An independent claim is also included for: the chip-size package structure.