发明名称 |
DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS FOR LINE AND VIA CONDUCTORS |
摘要 |
<p>Methods are disclosed for forming dual damascene back-end-of-line (BEOL) interconnect structures using materials for the vias or studs which are different from those used for the line conductors, or using materials for the via liner which are different from those used for the trench liner, or having a via liner thickness different from that of the trench liner. Preferably, a thick refractory metal is used in the vias for improved mechanical strength while using only a thin refractory metal in the trenches to provide low resistance.</p> |
申请公布号 |
EP1649510(A2) |
申请公布日期 |
2006.04.26 |
申请号 |
EP20040741743 |
申请日期 |
2004.06.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
GAMBINO, JEFFREY;COONEY, EDWARD, III;STAMPER, ANTHONY;MOTSIFF, THOMAS;LANE, MICHAEL;SIMON, ANDREW |
分类号 |
H01L21/768;(IPC1-7):H01L21/768 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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