| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device where a semiconductor element is mounted on bus bars united by a mold member capable of exhibiting excellent heat radiating performance, and to provide a method for manufacturing the semiconductor device. SOLUTION: At first, a plurality of bus bars 11-13 are molded and united by mold resin 1 so that those surfaces and back faces can be exposed. Secondly, the whole back faces of the united bus bars 11-13 and the mold member 1 are applied with high thermal conductive heat radiating resin 8 so as to be hardened. Thirdly, a heating face 15a of a heater 15 is butted to a surface 8a of the heat radiating resin 8 so that the heat radiating resin 8 can be heated and made uniform. Thus, the adhesiveness of the back faces of the bus bars 11-13 and the mold member 1 to the heat reading resin 8 can be improved, and the surface 8a of the heat radiating resin 8 can be made average by the heating face 15a. Afterwards, a semiconductor element 22 is mounted on the bus bar 12, and fixed to the cooling face of a heat sink. COPYRIGHT: (C)2003,JPO |
