发明名称 Polishing composition and polishing method employing it
摘要 <p>A polishing composition comprising the following components (a) to (g): (a) at least one abrasive selected from the group consisting of silicon dioxide, aluminum oxide, cerium oxide, zirconium oxide and titanium oxide, (b) an aliphatic carboxylic acid, (c) at least one basic compound selected from the group consisting of an ammonium salt, an alkali metal salt, an alkaline earth metal salt, an organic amine compound and a quaternary ammonium salt, (d) at least one polishing accelerating compound selected from the group consisting of citric acid, oxalic acid, tartaric acid, glycine, alpha -alanine and histidine, (e) at least one anticorrosive selected from the group consisting of benzotriazole, benzimidazole, triazole, imidazole and tolyltriazole, (f) hydrogen peroxide, and (g) water. f</p>
申请公布号 EP1229093(B1) 申请公布日期 2006.04.26
申请号 EP20020250359 申请日期 2002.01.18
申请人 FUJIMI INCORPORATED 发明人 ASANO, HIROSHI,;SAKAI, KENJI,;INA, KATSUYOSHI,
分类号 C09G1/02;B24B37/00;C09C1/68;C09K3/14;H01L21/304;H01L21/306;H01L21/3205;H01L21/321;H01L21/768 主分类号 C09G1/02
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