Method for processing a semiconductor wafer using a laminate substrate as a support for said semiconductor wafer,申请号EP20020025405-传众专利搜索

发明名称	Method for processing a semiconductor wafer using a laminate substrate as a support for said semiconductor wafer
摘要
申请公布号	EP1316992(B1)	申请公布日期	2006.04.26
申请号	EP20020025405	申请日期	2002.11.14
申请人	DISCO CORPORATION	发明人	NANJO, MASATOSHI,
分类号	H01L21/304;B28D5/00;B32B7/02;B32B7/06;B32B7/12;B32B27/08;B32B27/32;B32B27/36;B32B43/00;H01L21/00;H01L21/301;H01L21/68;H01L21/784	主分类号	H01L21/304
代理机构		代理人
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