发明名称 CATALYST PRECURSOR COMPOSITION FOR ELECTROLESS PLATING, AND PREPARATION METHOD OF TRANSPARENT ELECTROMAGNETIC INTERFERENCE SHIELDING MATERIAL USING THE SAME
摘要 <p>The present invention relates to a catalyst precursor composition for electroless plating, and more specifically, the present invention provides the catalyst precursor composition comprising (a) a reactive oligomer; (b) a reactive monomer; (c) a photoinitiator; (d) a catalyst precursor for electroless plating; and (e) a solvent, and a method of preparing the EMI shielding material with the same. The present invention provides an easy and simple method of preparing the EMI shielding material by using the catalyst precursor composition that contains a UV curable resin with good adhesion to the base material, thereby eliminating the need for pre-treating the base material with a receptive layer before electroless plating.</p>
申请公布号 EP1649077(A1) 申请公布日期 2006.04.26
申请号 EP20040748475 申请日期 2004.07.23
申请人 LG CHEM, LTD. 发明人 EU, SEUNG-HUN;LEE, JANG-HOON
分类号 C08F4/00;C23C22/05;C08F290/06;C23C18/16;C23C18/28;H05K9/00;(IPC1-7):C23C22/05 主分类号 C08F4/00
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