| 摘要 |
To prevent semiconductor chips from cracking during pick-up and during bonding. SOLUTION: A bonding tool (10) is constituted of a collet holder (20) and a collet (30). The collet holder (20) comprises a vacuum suction hole (21) at the center, attaching threaded holes (22, 23) for attaching the collet holder (20) to a support member, a depending section (24) at the bottom, and a recess (25) in the depending section (24). The collet (30) comprises a flat surface (31) at the lower end, a plurality of vertically extending vacuum suction through-holes (32), a projection (33) adapted to fit in the recess (25), and a flange (34) abutted against the lower surface of the depending section (24). A space (26) is defined such that the depth dimension H1 of the recess (25) and the height dimension H2 of the projection (33) are set H1 > H2, and communication is established between the vacuum suction holes (21, 32) through the space (26). The plurality of vacuum suction holes (32) vacuum-suck the periphery of a chip, whereby pick-up and bonding are effected.
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