| 摘要 |
PROBLEM TO BE SOLVED: To provide a tape carrier for a semiconductor device which tape carrier prevents dropping of a wiring pattern and facilitates transfer of the wiring pattern to the resin side. SOLUTION: According to the tape carrier 1 for the semiconductor device, an adhesive layer 3 is formed on a board to make a base 4, on which the wiring pattern 5 is formed, and then the wiring pattern 5 is coated with a surface treatment film 6, such as metal plating. The board is made of an insulating film 2 allowing UV-rays to pass therethrough, and the adhesive layer 3 is made of adhesive paste p whose adhesive strength declines when irradiated with UV-rays. COPYRIGHT: (C)2006,JPO&NCIPI |
