| 摘要 |
An integrated circuit package is proposed in which a laminar substrate 41 is provided with an aperture 43 . A heat-spreader member 1 is mounted to cover this aperture 43 , and contains a cavity 3 opening towards the aperture 43 in the substrate 41 . A stack of integrated circuit circuits 11, 21 , are located with one integrated circuit 21 of the stack inserted into the cavity 3 , and one integrated circuit 11 of the stack electrically connected to the substrate 41.
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