发明名称 Semiconductor device and manufacturing method thereof
摘要 A plurality of first wiring structures of a first width are arranged periodically at first intervals. A second wiring structure is formed next to one of the first wiring structures. The lower part of the second wiring structure has a second width substantially equal to the sum of n times the first width of the first wiring structure (n is a positive integer equal to two or more) and (n-1) times the first interval.
申请公布号 US2006081914(A1) 申请公布日期 2006.04.20
申请号 US20050291974 申请日期 2005.12.02
申请人 发明人 MIWA TADASHI
分类号 H01L29/788 主分类号 H01L29/788
代理机构 代理人
主权项
地址