发明名称 SUBSTRATE PLACING STAGE
摘要 PROBLEM TO BE SOLVED: To provide a substrate placing stage wherein pins overlap on a cut scheduled line when supporting a large sized substrate where a plurality of substrates are subjected to multiple patterning. SOLUTION: A plurality of fixed pins 3 are mounted on a support plate. The fixed pins 3 are disposed at positions, as viewed in a flat plane, which overlap on an outer peripheral edge L1 located outside the effective area of the large-sized substrate placed on the substrate placing stage, and are also disposed at positions which overlap on a cut scheduled line L2 where the large-sized substrate is subjected to two-face patterning. In contrast, a movable pin 5 is inserted into a through hole formed in the support plate, and the movable pins 5 are disposed at positions which overlap on cut scheduled lines L3, L4 where the large-sized substrate is further subjected to patterning. The lateral movable pins 5 are mounted in common on a coupled plate located below the support plate, hereby elevates the lateral movable pins 5 simultaneously by driving a cylinder unit. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006108265(A) 申请公布日期 2006.04.20
申请号 JP20040290898 申请日期 2004.10.04
申请人 TOKYO OHKA KOGYO CO LTD;TATSUMO KK 发明人 KAJIMA ATSUO;TAKASE SHINJI;YAMAGUCHI KAZUNOBU;YAMAMOTO YUUKI
分类号 H01L21/683 主分类号 H01L21/683
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