| 摘要 |
PROBLEM TO BE SOLVED: To provide a probe device capable of securing the alignment accuracy of a semiconductor wafer and a probe needle as usual in addition to the simplification of structure and the miniaturization of the whole device. SOLUTION: A probe device 20 travels on a scribe line in the X axial direction of a semiconductor wafer by four wheels 22a and travels on a scribe line 12b in the Y axial direction of the semiconductor wafer by four wheels 22b. In the lower part of the probe device 20, a probe needle fixture 26 which fixes two or more probe needles 25 is formed so that the probe needle fixture 26 can move in the Z direction. At one corner of the lower part of the probe device 20, there is provided a sensor 27 for detecting an intersecting section of the scribe lines of the X axial direction and the Y axial direction. COPYRIGHT: (C)2006,JPO&NCIPI
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