PACKAGING METHOD OF ELECTRONIC COMPONENT

摘要

A packaging method of an electronic component capable of enhancing electrical and mechanical bonding reliability of the electronic component. A terminal (4) is provided on the side face of the electronic component (1). An electrode (6) is formed on one or the other major surface of a substrate (5) such that the terminal (4) provided in the electronic component (1) is located on the electrode (6). Solder paste produced by mixing solder particles with thermosetting flux is applied to the electrode (6), the terminal (4) of the electronic component (1) is mounted on the solder paste in contact therewith, and then the electronic component (1) is mounted on the substrate (5) under such a state as a clearance (S) is provided between a part of the electronic component (1) and the opposing substrate (5). A solder bond structure (8) coupling the terminal (4) and the electrode (6) is formed by reflow. The solder bond structure (8) includes a solder bonding portion (8a), a resin reinforcing portion (8b) and a resin adhering portion (8c). The resin reinforcing portion (8b) reinforces the solder bonding portion (8a), and the resin adhering portion (8c) firmly bonds the electronic component (1) to the substrate (5) when the resin spread into the clearance (S) between the electronic component (1) and the substrate (5) is cured.